• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A focal plane array (FPA), comprising a photodiode array (PDA) and an integrated reading circuit (ROIC). The PDA may include a plurality of conductive through vias extending through the PDA and electrically isolated from the PDA. The plurality of conductive through vias may be electrically coupled to circuitry on the ROIC circuit side. The plurality of conductive through vias may include I / O interconnects such as BGA or other boss chip protruding interconnects that replace the conventional wire feeder links, thereby reducing the need for the area for pads. connection on the ROIC and offering a complete zone coverage of the ROIC circuitry by PDA bulk material. Embodiments can thus eliminate wire connections by binding to a plurality of metal traces for the routing of these interconnects. In one embodiment, an optically transparent cover may include a plurality of traces electrically coupled to the plurality of conductive through vias.
    公开号:BE1023972B1
    申请号:E2014/0172
    申请日:2014-03-14
    公开日:2017-09-27
    发明作者:Peter E. Dixon
    申请人:Sensors Unlimited Inc.；
    IPC主号:
    专利说明:

    VIAS THROUGH FIERY PLANAR MATRIX PERIPHERAL FOR
    INTEGRATED READING CIRCUIT
    DOMAIN OF MODES OF REALIZATION
    The present teachings relate to the field of integrated circuits and more particularly to packaging for a focal plane array device comprising a photodiode array and an integrated readout circuit.
    HISTORY OF MODES OF REALIZATION
    Light-sensitive image sensors such as focal plane array (FPA) devices include a photodiode array (PDA) packaged with an integrated readout circuit (ROIC). Many different FPA package configurations are available including, for example, wired or wireless enclosures. Each type of conventional housing for FPA can include various common features.
    Figure 3 shows a schematic section of an FPA 200 device packaged as a wireless chip carrier (LCC). Figure 3 comprises a ceramic, plastic, or resin-based support body 202 having internal traces 204 electrically coupled to external studs or crenels 206. The outer pads 206 may be surface mounted on a circuit board using a conductor, or the device 200 can be placed in an LCC socket. Figure 3 further shows a ROIC 208 physically attached to the support 202 using an adhesive 210. Connecting wires 212 electrically couple connection pads (not shown individually for simplicity) on the ROIC 208 to the traces 204 in the body 202 such that the circuitry on the ROIC 208 is electrically accessible through the outer pads 206. A PDA 214 is mounted on the upper surface of the ROIC 208 using a non-conductive adhesive (not shown individually for the sake of convenience). simplicity). A housing cover 216 hermetically sealed to the support 202 includes a transparent window 216A that exposes the PDA 214 to the outside light. In the device of FIG. 3, the support 202 is configured so that the lower surface of the cover 216 does not communicate with the loop in the connection wires 212. FPAs including ROICs and PDAs provided in the different styles of casing are well known.
    Design goals for semiconductor device engineers include the provision of devices having smaller dimensions, reduced cost, and improved reliability. A device design that would contribute to one or more of these objectives would be desirable.
    SUMMARY OF EMBODIMENTS
    The following is a simplified summary to provide a basic understanding of some aspects of one or more embodiments of the following teachings. This summary is not an overview, it is neither intended to identify the key or critical elements of the present teachings, nor to delimit the scope of the invention. On the contrary, its main purpose is simply to present one or more concepts in a simplified way as a prelude to the detailed description presented later.
    In one embodiment of the present teachings, a focal plane array (FPA) may comprise an integrated readout circuit (ROIC) having a circuit side with a circuitry thereon, a photodiode array (PDA) including a plurality of photodiodes, a plurality of conductive through vias extending through the PDA, wherein the plurality of conductive vias are electrically isolated from the PDA. The FPA may further include a conductor that electrically couples the circuitry on the side of the ROIC circuit to the plurality of conductive through vias that extend through the PDA.
    In another embodiment of the present teachings, the method for forming a focal plane array (FPA) may include forming a plurality of conductive through vias extending through an array of photodiodes (PDAs) that are electrically isolated. of the PDA, wherein the PDA comprises a plurality of photodiodes and wiring electrically coupled to the circuitry on one circuit side of the integrated read circuit (ROIC) to the plurality of conductive through vias extending through the PDA.
    BRIEF DESCRIPTION OF THE DRAWINGS
    The accompanying drawings, which are incorporated herein and form part of this specification, illustrate embodiments of the present teachings and together with the description serve to explain the principles of the invention. In the figures:
    Figure 1 is a cross section of a device according to an embodiment of the present teachings packaged as a wireless chip carrier (LCC);
    Figures 2A-2D show various structures in the course of manufacture that may result from a process for forming conductive through vias in an embodiment of the present teachings; and
    Figure 3 is a cross-section of a conventional device packaged as an LCC.
    It should be noted that some of the details on the Figures have been simplified and are illustrated to facilitate understanding of the present teachings rather than to preserve strict structural precision, detail and scale.
    DESCRIPTION OF EMBODIMENTS
    Reference will now be made in detail to the exemplary embodiments of the present teachings, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers will be used throughout the drawings to refer to the same or similar parts.
    Although the embodiments of the present teachings are described with reference to a device packaged as a wireless chip carrier (LCC), it will be understood that a device in accordance with the present teachings may be packaged as a device with wires or as other wireless devices.
    Achieving reliable electrical connections in a conventional device housing makes the reduction of device dimensions more difficult. Connection leads 212, such as those shown in Figure 3, are relatively large and therefore require large connection pads as the connecting surface. For example, the conventional reading integrated circuit (ROIC) connection pads for focal plane array (FPA) devices may be from about 100 μm to about 160 μm. In addition, the lower surface of the cover 216 should be above the top of the loop of the lead wire 212, as shown in Figure 3, which increases the overall height of the housing. In addition, the ROIC must be larger than the photodiode array (PDA), so that the connection pads located at the periphery of the ROIC are exposed for a wire connection.
    One embodiment of the present teachings may result in a more robust electrical connection between a circuitry on the ROIC and connections outside the housing relative to the conventional package connection wires. In addition, in one embodiment of the present teachings, the ROIC can be downsized to have the same external dimensions as the PDA, thus allowing perimeter (i.e., footprint) dimensions of the package. to be smaller. In addition, the connecting wires are eliminated which allows the height of the housing to be reduced, for example because the lower surface of the cover may be closer to the PDA than is possible with conventional devices.
    Figure 1 is a schematic cross section illustrating an FPA device 10 according to an embodiment of the present teachings, and includes a first semiconductor chip which may be a PDA 12 and a second semiconductor chip which may be a ROIC. 14. It will be appreciated that PDA 12 and ROIC 14 can be formed using conventional technology unless specified. In the embodiment of Figure 1, the FPA device 10 can not include any wire connections, particularly wire connections that provide power and ground for the ROIC, and / or input / output signals. (I / O) to and from ROIC 14.
    In the device of Figure 1, a plurality of conductive vias 16 may be formed in the periphery of the PDA 12 during or after the manufacture of the PDA circuit 12. In one embodiment, a plurality of through vias openings 16 can be fully etched through the PDA 12 from the back surface to the front surface of the PDA 12, so that each through via extends through (i.e., completely through) a thickness. of the PDA. A plurality of via apertures 24 (Figure 2) may be etched at an otherwise unused periphery, which are then filled with a conductor 16.
    Although various methods of forming the plurality of conductive vias 16 are contemplated, one method is shown in Figures 2A-2D. In Figure. 2A, a patterned mask 20, for example a photoresist, having a plurality of apertures is formed on a surface of the PDA 12 according to known lithographic techniques. Then, a mechanical or chemical etching reagent 22 suitable for the PDA material 12, which is typically epitaxial silicon, is used to perform vertical or near vertical anisotropic etching of the PDA 12 to form vias vias 24 as shown. in Figure 2B. In another embodiment, a laser may be used to form the apertures 24 by laser ablation of the apertures 24 through the apertures of the PDA 12. The apertures 24 may have any desired shape such as square, rectangular, circular or oval and may have a width, a length and / or a diameter of between about 2 μm and about 10 μm, or between about 4 μm and about 6 μm, for example about 5 μm. This is in contrast to conventional bond pads which can be about 100 μm by 160 μm.
    Prior to filling the vias apertures 24, the side walls of the apertures 24 may be electrically insulated with a dielectric coating 34 (Figure 2D) such as silicon dioxide. The conformal dielectric coating may be formed using any known method, such as chemical vapor deposition. The dielectric coating can prevent electrical interference between vias 16 and PDA 12. In the embodiment of FIG. 2, a conformal dielectric layer 26 may be formed at least within openings 24 and in realization, on at least one surface or on both front and rear surfaces. Then, a conductor 28, such as a metal is deposited at least in the openings 24 and in embodiments, on at least one surface or both on the front and back surfaces, of the PDA 12, which can be protected by the conformal dielectric layer 26. Thereafter, the metal 28 is etched isotropically using a driving reagent 30, for example wet etching, i.e., selective to the dielectric layer 26 and the layer dielectric 26 is used as an etch stop. Thus, once the dielectric layer 26 is exposed during etching of the conductor 28, the etching is stopped. Then, the dielectric layer 26 on the upper and lower surfaces of the PDA 12 is removed, for example using vertical isotropic etching or a mechanical process such as chemical mechanical planarization (CMP). As shown in FIG. 2D, this results in a conductive via via 16 and the dielectric coating 34 which electrically isolates the PDA 12 substrate and circuitry from the conductive via via 16.
    In another embodiment, the dielectric coating 34 may be omitted and the peripheral area of the PDA may be doped, either before or after the formation of the conductive via via 16, to decrease the conductivity of the PDA substrate in the area of via In yet another embodiment, the dielectric layer 26 may be left on the front side and the rear side of the PDA to function as a passivation layer.
    Prior to assembly of the device, with reference to Fig. 1, a lid (ie, window) 40 is prepared. The cover 40 may be a material that is optically transparent (which, for purposes of the present invention, includes optically translucent) at the wavelength of light to be detected by the completed FPA. In various embodiments, the cover 40 may be glass, a polymer, or a semiconductor material such as silicon, depending on the wavelength of light to be detected. To prepare the lid 40, a plurality of patterned conductive traces 42 are formed on the lower surface of the lid 40, where the bottom surface is within the finished FPA 10.
    In one embodiment, a cover conductive layer may be formed on the bottom surface of the cover, for example using a CVD or a sputtering method, which is then patterned and etched using known lithographic techniques. Using this method, the traces will extend from the bottom surface of the lid a distance equal to the thickness of the traces. In one embodiment, traces 42 may have a width of from about 2 μm to about 25 μm depending on the needs of appropriate conductivity or current resistance requirements. The traces 42 may also have a height of between about 10 μm and about 200 μm, providing a greater range of ability to handle high interconnect density, thus allowing for design freedom that was previously limited by pad layout. connection. In addition, traces 42 may have a thickness of between about 1 μm and about 5 μm, depending on electrical or mechanical requirements. Trace formation of these dimensions helps align tracks with conductive through vias and provides acceptable electrical resistance to traces.
    In another embodiment for forming the traces 42, a plurality of trenches may be etched chemically or mechanically by means of a lithographic process or etched in the lower surface of the lid. A conductive cover layer may be formed on the lower surface within the trench and then a polishing process may be used to remove the conductive cover layer from the lower surface of the cover 40 except for the trench (a process generally referred to as a damascene process). Using this method, the exposed surface of the traces will be coplanar or substantially coplanar with the bottom surface of the lid, or may be embedded within the trenches.
    Figure 1 further illustrates a device housing body 44 made according to known techniques. The case body 44 of Figure 1 is an LCC case, but it should be understood that various embodiments of the present teachings may include a different case body 44 having other wire or wireless form factors, or a board. printed circuit board (PCB) or other substrate. The housing body 44 may include internal traces 46, each of which may terminate at a first end in a landing pad (not shown individually for simplicity) internal to the housing body 44 and at a second end in a pad or In a wire configuration, the traces 46 will be the wires that extend from the inside of the completed housing 10 through the housing body 44 to terminate into device wires, such as double-line box (DIP) wire, single-line box (SIP), etc.
    After the subsystems of the device, including the PDA 12, the ROIC 14, the cover 40 and the housing body 44 are terminated, assembly of the subsets of the device can begin. The conductor 50 may be interposed between the conductive through vias 16 of the PDA 12 and the landing pads (not shown individually) on the upper surface (e.g., one circuit side) of the ROIC 14. In one embodiment, a Conductor 50, such as a fluid metal or conductive epoxy material may be applied to either conductive through vias 16, landing pads on ROIC 14, or both. The fluid metal of the various embodiments may comprise bead matrix (BGA) bumps. The conductor 50 is then processed if necessary using a suitable technique for the conductor 50 to physically and conductively fix the pads on the ROIC 14, which are themselves electrically coupled to the circuitry (not shown individually for simplicity) on the upper surface of the ROIC 14, the conductive through vias 16 of the PDA 12. The ROIC circuitry 14 is thus electrically coupled to the conductive through vias 16 using the conductor 50.
    In one embodiment, a dielectric 52 may be used to physically connect the ROIC 14 to the PDA 12. It should be readily apparent to those having ordinary skill in the art that the APF 10 shown in Figure 1 represents a generalized schematic illustration. and that other components can be added or existing components can be deleted or modified.
    After the electrical coupling of the conductive through vias 16 with the landing pads and circuitry on the side of the ROIC circuit 14, a first end of the conductive vias 16 may be electrically coupled to the tracks 42 on the lower surface of the cover 40. using a sufficient technique, for example using a metal, a conductive epoxy material, etc. Subsequently, a second end of the conductive traces 42 on the cover can be electrically connected to the traces 46 within the housing body 44. In one embodiment, a conductor 54, such as a fluid metal or a conductive epoxy material can be used and processed according to known techniques.
    If desired, the attachment of the cover 40 to the PDA 12 may further include the use of a dielectric material 56 for attaching and securing the cover 40 to the PDA 12. If used, the dielectric material 56 may be optically transparent to the wavelength of the light being detected or measured by the PDA 12. The dielectric material 56 may comprise a polymer, a glass frit material, a thermoplastic material, a thermosetting material, etc., which are deposited and processed using appropriate techniques.
    The conductor 54 electrically couples the traces 42 on the cover 40 to the traces 46 by the housing body 44. A physical connection of the cover 40 to the housing body 44 may include the use of a hermetic sealant 58 such as a metal, an epoxy, a polymer, a eutectic, etc.
    Thus, an electrical path can be established between a circuitry on one side of the ROIC circuit 14, through a plurality of circuit landing pads (not shown individually for simplicity) on the circuit side (upper surface as shown). in Figure 1) of ROIC 14, through a plurality of first conductors 50 which electrically couple the landing pads of ROIC 14 (not shown individually for simplicity) to the plurality of conductive vias 16 at a plurality of second conductors (not shown individually for simplicity) that electrically couple the plurality of conductive vias 16 to the plurality of traces 42 on the surface of the cover 40. The plurality of traces 42 on the cover 40 are electrically coupled to the plurality of body case traces 46 using a third conductor 54. In turn, the plurality of t Housing body races 46 are electrically coupled to a plurality of pads 48 on an outer surface of the housing body 44.
    In one embodiment, the lower (i.e., non-circuit) surface of the ROIC 14 may be attached to a surface of the housing body 44 using a conductive or dielectric fastening material 60, which fixes the ROIC 14 in the housing body 44 and can provide support for other connections such as the connections 50 and 54. In another embodiment, the structure 60 may schematically show a thermoelectric cooler (TEC).
    Thus, the embodiment of Figure 1 provides an FPA 10 which routes signals from the ROIC circuitry 14 within the housing 10 to pads 48 on an outer surface of the housing 10 without the use of connection wires 212. , such as those shown in FIG. 2. Electrical interconnections on the circuit side of the ROIC 14 are accessible from the front side of the PDA 12, using the conductive through vias 16 which extend from the rear side (non-circuit). ) from the PDA 12 to the front panel (circuit) of the PDA 16.
    In addition, the ROIC 14 may be formed with peripheral dimensions that are the same as, or smaller than, the perimeter dimensions of the PDA 12 (i.e., with the same footprint). In one embodiment, the ROIC 14 perimeter dimensions in the X and Y directions are of the same size, about the same size (taking into account the variability of the process), or smaller than the perimeter dimensions of the PDA in the X and Y directions respectively. Because the ROIC 14 can be formed with smaller dimensions than the ROICs of conventional devices, the overall dimensions of the FPA 10 may be smaller than on conventional devices. In addition, covering the circuit surface of ROIC 14 in its entirety with PDA 12 can provide physical or electrical protection against adverse environmental effects or external radiation.
    Further, an FPA having a smaller height may be formed, for example because the lower surface of the lid 40 may be closer to, and even directly attached to, an upper surface of the PDA 12. In addition, the plurality of Electrical connections in the FPA 10 can be smaller and more reliable than the 212 connection wires.
    Notwithstanding the fact that the ranges and numerical parameters of the wide scope of the present teachings are approximations, the numerical values provided in the specific examples are presented as precisely as possible. Any numerical value, however, inherently contains some errors inevitably resulting from the standard deviation found in their respective control measures. In addition, all ranges disclosed herein should be understood to encompass any and all sub-ranges summarized herein. For example, a range of "less than 10" can include any and all sub-ranges between (and including) the minimum value of zero and the maximum value of 10, i.e. all sub-ranges having a minimum value equal to or greater than zero and a maximum value equal to or less than 10, for example, from 1 to 5. In some cases, numerical values as indicated for the parameter may take negative values. In this case, the exemplary value of the range declared at "less than 10" may assume negative values, for example, -1, -2, -3, -10, -20, -30, and so on.
    Although the teachings herein have been illustrated with respect to one or more implementations, alterations and / or modifications may be made to the illustrated examples without departing from the spirit and scope of the appended claims. For example, it will be appreciated that although the process is described as a series of acts or events, the present teachings are not limited by the order of the acts or events. Some acts may occur in different orders and / or simultaneously with other acts or events outside of those described here. Also, not all process steps may be necessary to implement a methodology in accordance with one or more aspects or embodiments of the present teachings. It will be appreciated that structural components and / or processing steps can be added or that existing structural components and / or processing steps can be removed or modified. In addition, one or more of the acts described in this document can be performed in one or more separate acts and / or phases. Furthermore, to the extent that the terms "including", "includes", "having", "a", "with", or variants thereof are used in either the detailed description and the claims, such terms are intended to be inclusive in a manner similar to the term "comprising".
    The term "at least one of" is used to designate one or more of the enumerable items that can be selected. In addition, in the discussion and claims here, the term "to" used with respect to two materials, "to" each other, means at least some contact between the materials, while "on" means that the materials are nearby, but perhaps with one or more additional intermediate materials so that contact is possible, but not mandatory. Neither "to" nor "on" implies any directivity as used herein. The term "compliant" describes a coating material in which the angles of the underlying material are retained by the compliant material. The term "about" indicates that the indicated value may be somewhat modified, as long as the change does not result in the non-compliance of the process or structure of the illustrated embodiment. Finally, "exemplary" indicates the description that is used as an example, rather than implies that it is an ideal. Other embodiments of the present teachings will be apparent to those skilled in the art of examining the specification and the practice of the present invention. It is intended that the specification and examples should be considered exemplary only, with real scope and the spirit of the present teachings being indicated by the following claims.
    Relative position terms as used in this application are defined based on a plane parallel to the conventional plane or working surface of a workpiece, regardless of the orientation of the workpiece. The term "horizontal" or "lateral" as used in this application is defined as a plane parallel to the conventional work surface or work surface of a workpiece, regardless of the orientation of the workpiece. The term "vertical" means a direction perpendicular to the horizontal. Terms such as "to", "side" (as in "sidewall"), "upper", "lower", "on", "high" and "below" are defined relative to the conventional plane or surface of work being on the upper surface of the workpiece, regardless of the orientation of the workpiece.
    权利要求:
    Claims (14)
    [1]
    A focal plane array (FPA), comprising: an integrated readout circuit (ROIC) comprising a circuit side having a circuitry thereon; a photodiode array (PDA) comprising a plurality of photodiodes; a plurality of conductive through vias extending through the PDA, wherein the plurality of conductive through vias are electrically isolated from the PDA; and a conductor that electrically couples the circuitry on the circuit side of the ROIC to the plurality of conductive through vias that extend through the PDA. a housing body; an optically transparent cover attached to the housing body, wherein the housing body and the cover define an interior of the FPA and wherein the PDA and the ROIC are sealed within the FPA; and a plurality of conductive traces on an inner surface of the cover, wherein the plurality of conductive through vias are electrically coupled to the plurality of conductive traces on the inner surface of the cover.
    [2]
    The focal plane array of claim 1, further comprising a plurality of trenches on the inner surface of the cover, wherein the plurality of traces is within the plurality of trenches.
    [3]
    The focal plane array of claim 2, wherein the conductor that electrically couples the circuitry on the ROIC circuit side of the plurality of conductive vias comprises a fluid metal or a conductive epoxy material.
    [4]
    The focal plane array of claim 1, further comprising a plurality of traces within the housing body, wherein the plurality of traces on the interior surface of the cover is electrically coupled to the plurality of traces at the inside the case body.
    [5]
    The focal plane array of claim 1, further comprising a dielectric which physically connects the PDA to the inner surface of the cover.
    [6]
    The focal plane array of claim 1, wherein the perimeter of the ROIC in the X and Y directions is about the same size as the perimeter of the PDA in the X and Y directions, respectively.
    [7]
    The focal plane array of claim 1, wherein the ROIC circuit side is fully covered by the PDA.
    [8]
    The focal plane array of claim 1, further comprising a dielectric coating interposed between the PDA and the conductive via via which electrically isolates the PDA from the conductive via via.
    [9]
    A method of forming a focal plane array (FPA), comprising: forming a plurality of conductive through vias extending through a photodiode array (PDA) which are electrically isolated from the PDA, wherein the PDA comprises a plurality of photodiodes; circuitry electrically coupled on one circuit side of an integrated readout circuit (ROIC) to the plurality of conductive through vias that extend through the PDA. an integrated readout circuit (ROIC) comprising a circuit side having a circuitry thereon: a housing body; an optically transparent cover attached to the housing body, wherein the housing body and the cover define an interior of the FPA and wherein the PDA and the ROIC are sealed within the FPA; and a plurality of conductive traces on an inner surface of the cover, wherein the plurality of conductive through vias are electrically coupled to the plurality of conductive traces on the inner surface of the cover.
    [10]
    The method of claim 9, further comprising: attaching an optically transparent cover to a housing body, wherein the housing body and the cover define an interior of the FPA and the PDA and ROIC are sealed in the housing inside the FPA during the fixing of the optically transparent lid on the case body; and electrically coupling a plurality of conductive traces on an inner surface of the cover to the plurality of conductive through vias.
    [11]
    The method of claim 10, further comprising: forming a plurality of trenches on the interior surface of the lid; forming a metal cover layer on the inner surface of the cover and within the plurality of trenches on the inner surface of the cover; and planarizing the metal covering layer to form the plurality of conductive traces.
    [12]
    The method of claim 11, further comprising electrically coupling the circuitry on the circuit side of the ROIC with the plurality of conductive through vias using a material selected from the group consisting of a fluid metal and a conductive epoxy material.
    [13]
    The method of claim 11, further comprising physically joining the inner surface of the PDA cover with a dielectric.
    [14]
    The method of claim 11, further comprising: providing a PDA having a perimeter in the X and Y directions; and providing a ROIC having a perimeter in the X and Y directions, wherein the perimeter of the ROIC in the X and Y directions is about the same size as the PDA perimeter in the X and Y directions, respectively .
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    法律状态:
    2018-01-10| FG| Patent granted|Effective date: 20170927 |
    优先权:
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